Micross Components

Semiconductor Die and Specialized Packaging Solutions

Micross Components is a leading global provider of distributed and specialty electronic components for medical, military, space, and demanding industrial applications. Operating as a single source for high reliability and state-of-the-art electronics, Micross’ solutions range from bare die and wafer processing to advanced and custom packaging to component modifications and related interconnect offerings. With a 30+ year heritage, Micross possesses the design, manufacturing, and logistics expertise needed to support an application from start to finish.

Bare Die and Wafer Processing
Authorized by the industry’s major semiconductor manufacturers, Micross Components offers a vast range of technologies. With our complete wafer processing capabilities, we can provide the performance of Off-the-Shelf (OTS) products in the smallest form factor available – bare die – allowing increased miniaturization of your device.

Packaging Solutions
When OTS products cannot be used, and handling bare die is either impractical or too costly, we can provide the right solution through our multiple packaging options.Micross custom packages are have been used in Class 3 medical devices.

Chip Scale Packaging (CSP) – a best fit for those seeking the smallest form factor with ease of handling. Because our CSP’s are designed in-house, features such as package thickness, leaded or lead-free balls, and signal routing can be customized to your device.

Multi-Chip Modules – a solution that provides the advantage of increased functionality and performance with overall space savings. By integrating multiple die into a single package, Micross Components can broaden design options and improve management of product life cycles.

Wafer Level CSP (WLCSP) – an option gaining popularity in the medical manufacturing industry for its size, weight, and cost savings once a device goes into production. WLCSP is not a “packaging solution,” per se, but rather a modification of the bare die itself by redistribution of the bond pads; hence the size savings.

Other options include, but are not limited to – hermetic/ceramic packaging, custom packaging, high-reliability COTS/iPEM’s/Micro SSD’s, and robotic solder exchange from lead-free to SnPb finished terminal leads for tin whisker mitigation.

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Life Cycle Planning & Obsolescence Management
Continued component availability is a source of concern for many manufacturers, most especially medical device manufacturers. Through strong relationships with our electronics suppliers, Micross Components can support you with strategic planning and up-to-date information on potential changes in product lines and product availability.

FEATURES & BENEFITS

  • Recognized industry leader with the broadest range of specialty electronics solutions, offering the smallest form factors available for next generation builds or new product designs.
  • Significant space and weight savings via bare die or other packaging options smaller than those offered by semiconductor manufacturers.
  • Design consulting and custom packaging production.
  • ISO certified supplier of custom, high-reliability components for medical, military, space and critical industrial applications.
  • On shore production facilities, as well as the technical expertise needed, to insure conformance to your manufacturing and process control requirements.

Contact Information

Micross Components

7725 N. Orange Blossom Trail
Orlando, FL, 32810
USA

tele: 407.298.7100
fax: 407.290.0164
sales.america@micross.com
www.micross.com/

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